THERMALLY CONDUCTIVE INSULATION SHEET, METAL BASE SUBSTRATE AND CIRCUIT BOARD

• Main Authors: YAMAGATA TOSHITAKA, MIYATA KENJI
• Format: Patent
• Language: English
• Published: 20.12.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONDUCTORS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PRINTED CIRCUITS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SEMICONDUCTOR DEVICES; TRANSPORTING

PROBLEM TO BE SOLVED: To provide a thermally conductive insulation sheet exhibiting excellent insulation and heat dissipation, and to provide a metal base substrate and a circuit board.SOLUTION: On one or a plurality of longitudinally oriented sheets 4 where hexagonal boron nitrides 2 are oriented in the thickness direction, one or a plurality of laterally oriented sheets 3 where hexagonal boron nitrides 2 are oriented in the width direction or the length direction are laminated to produce a thermally conductive insulation sheet 1. Total thickness of the longitudinally oriented sheets 4 is set thicker than the total thickness of the laterally oriented sheets 3. In addition, the thermally conductive insulation sheet 1 and a conductive layer are laminated, in this order, on a metal base material so that the laterally oriented sheet 3 is disposed on the conductor layer side thus obtaining a metal base substrate. Furthermore, a metal base circuit board is produced by processing the conductor layer of the metal base substrate.