MOUNTING BOARD WITH FLIP-CHIP STRUCTURE, MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE

• Main Authors: RAI AKITERU, MORITA YOSHIRO, SUMIKAWA MASAHITO
• Format: Patent
• Language: English
• Published: 13.12.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a mounting board that allows mounting a semiconductor light-emitting element with accurate positioning when mounting the semiconductor light-emitting element by flip-chip bonding.SOLUTION: A mounting board 1 that allows mounting a semiconductor light-emitting element 20 by flip-chip bonding comprises: a first pattern formed so as to extend in a first direction; a first alignment pattern M1 made from the same material as the first pattern; a second pattern PR1 made from a resist material for solder-wet prevention and formed so as to extend in a second direction different from the first direction; and a second alignment pattern M2 made from the same resist material as the second pattern PR1. A bump formation region R is set in a rectangular region in which the boundary in the second direction is defined by the first pattern and the boundary in the first direction is defined by the second pattern PR1.