CUT PROCESS METHOD OF WOODY PLATE-LIKE MEMBER, AND CUT PROCESS METHOD OF FLOOR MATERIAL

PROBLEM TO BE SOLVED: To provide a cut process method of a woody plate-like member, in which no finish processing is required, and a cut process method of a floor material, in which no finish processing is required.SOLUTION: When the woody plate-like member 1 is cut, an adhesive 3 is applied in adva...

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Bibliographic Details
Main Authors SHINDO NORITAKA, HOTTA TOSHIRO
Format Patent
LanguageEnglish
Published 10.12.2012
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Summary:PROBLEM TO BE SOLVED: To provide a cut process method of a woody plate-like member, in which no finish processing is required, and a cut process method of a floor material, in which no finish processing is required.SOLUTION: When the woody plate-like member 1 is cut, an adhesive 3 is applied in advance to a cutting part 2 of the plate-like member 1 and cured. Cutting of the concerned part by a cutting blade 4 starts. The cutting blade 4 cuts the part impregnated with the adhesive 3 of the plate-like member 1 and cuts off it. Further, a cut-planned part 17, in which an actual structure 15 of the floor material 21 which is a woody plate-like member is formed, is impregnated with the adhesive 13. Thereafter, the cut-planned part 17 is cutting-machined and cut out.
Bibliography:Application Number: JP20110115392