COMBINATION OF OPTICAL ELEMENT TO LIGHT EMITTING DEVICE

• Main Authors: WILLIAM R IMMLER, FRANK M STERANKA, HELENA TICHA, CAMRAS MICHAEL D, WALL FRANKLIN J JR, KRAMES MICHAEL R, RADISRAV TICHY
• Format: Patent
• Language: English
• Published: 06.12.2012
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMSTHEREOF; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHERARTICLES, NOT OTHERWISE PROVIDED FOR; WEAPONS

PROBLEM TO BE SOLVED: To provide a technology capable of combining optical elements to one light emitting device die or more.SOLUTION: A device in which at least one light emitting device (LED) die is mounted to a submount, next the optical element is thermally combined to this LED die. An LED die 104 is electrically combined to a submount 106 through a contact bump having a melting point higher than a temperature used for thermally combining an optical element 102 to the LED die 104. In one embodiment, a single optical element is combined to each of plurality of the LED die mounted to the submount, and the submount 106 and the optical element 102 have roughly the same coefficients of thermal expansion. Alternatively, several optical elements can be employed. The optical element or the LED die can be covered with a coating of a wavelength transforming material. In one embodiment, the element is inspected for determining a generated wavelength, and the additional layer of the wavelength transforming material is added until a desired wavelength is created.