WIRING BOARD MANUFACTURING METHOD

• Main Authors: OKAMOTO HAJIME, MATSUURA TOSHIHIDE, IZUMI MASARO, HASEGAWA CHIKAYASU
• Format: Patent
• Language: English
• Published: 22.11.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS

PROBLEM TO BE SOLVED: To form each solder bump satisfactorily when forming on a wiring board a plurality of types of solder bumps having different heat-melting conditions.SOLUTION: A method for manufacturing a wiring board, having bumps disposed on a plurality of electrode pads forming a surface of a wiring board main body, includes: a first step for preparing a mask, having an opening that is open on a portion of the electrode pads among the plurality of electrode pads, to cover the other electrode pads; with the disposition of the mask on the surface side of the wiring board main body, a second step for forming a bump formation portion, containing a solder material, on a portion of the electrode pads that expose outside through the opening of the mask; a third step for forming a first solder bump from the bump formation portion by heat-melting processing on the bump formation portion; and a fourth step for forming a second solder bump by supplying the ejection of a heat-melted solder material to each of the other electrode pads.