THERMOSETTING RESIN COMPOSITION AND PREPREG, LAMINATE BOARD AND CIRCUIT BOARD USING THE SAME

• Main Authors: IKEDA KENICHI, SHIMIZU HIROSHI, KYO TAMAKA, AKIYAMA MASANORI
• Format: Patent
• Language: English
• Published: 22.11.2012
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition free of halogen, and small in fluctuation of relative permittivity and dielectric loss tangent; and to provide a prepreg, laminate board and circuit board each using the composition.SOLUTION: This thermosetting composition includes: (A) an aluminum salt of diethylphosphinic acid having a structure represented by general formula (1) and an average particle diameter of 0.5-3 μm; (B) a maleimide compound having an N-substituted maleimide group in the molecule; (C) a curing agent comprising a 6-substituted guanamine compound or dicyandiamide; and (D) an epoxy resin having at least two epoxy groups in one molecule (in formula, Rrepresents a phenyl, methyl, butyl, allyl, methoxy or benzyloxy group). The prepreg, laminate board and circuit board each using the composition are provided.