FOAM

• Main Authors: SUEOKA MASANORI, NAKAMURA HIROKADO, HAMAZAKI RISA
• Format: Patent
• Language: English
• Published: 08.11.2012
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; WORKING-UP

PROBLEM TO BE SOLVED: To provide a resin foam that is excellent in heat insulation performance, heat resistance, and environmental performance and can be suitably used as a heat insulating material for building materials, consumer electronics, and motor vehicles.SOLUTION: The resin foam is an aromatic polyester resin foam where, when defining that a hole (L) is a hole having a pore size of 10 μm or more and 500 μm or less and a hole (S) is a hole having a pore size 0.01 μm or more and less than 1 μm, two peaks are present in the pore size distribution, and one of them is derived from the hole (L) and the other is derived from the hole (S).