METHOD OF MANUFACTURING PIEZOELECTRIC VIBRATOR, PIEZOELECTRIC VIBRATOR PRODUCED BY THE MANUFACTURING METHOD, AND OSCILLATOR, ELECTRONIC APPARATUS AND ELECTRIC WAVE CLOCK HAVING THE PIEZOELECTRIC VIBRATOR

PROBLEM TO BE SOLVED: To decrease the value of bonding width L of a base substrate and a lid substrate of each piezoelectric vibrator.SOLUTION: A plurality of base substrates 2 each of which includes two through electrodes 7 are formed on a base substrate wafer 40, and a piezoelectric element piece...

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Bibliographic Details
Main Author FUNABIKI YOICHI
Format Patent
LanguageEnglish
Published 25.10.2012
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Summary:PROBLEM TO BE SOLVED: To decrease the value of bonding width L of a base substrate and a lid substrate of each piezoelectric vibrator.SOLUTION: A plurality of base substrates 2 each of which includes two through electrodes 7 are formed on a base substrate wafer 40, and a piezoelectric element piece 4 is mounted on each base substrate 2. Further, a plurality of lid substrates 3 each including a recess 3a are formed on a lid substrate wafer 50 to form a bonding film 35. By making the base substrate wafer 40 abut the lid substrate wafer 50 and performing anodic bonding to the wafers, a wafer body 60 that includes a plurality of piezoelectric vibrators 1 is fabricated. After that, by irradiating l the lid substrate wafer 50 side with laser light along the cutting line of each piezoelectric vibrator 1 to create a cut line, and pressing the wafer body by a sharp pressing blade 830 from the opposite side, the wafer body is sequentially cut. A cut surface can be clearly divided by pressing the cut line by the laser from the opposite side in this manner.
Bibliography:Application Number: JP20110071422