LED PACKAGE

PROBLEM TO BE SOLVED: To solve the problems such as heat radiation and thermal expansion in an LED package to make a package into the one by which large light intensity is obtained than in the present one, and to simultaneously suppress costs.SOLUTION: For an LED consisting of: an LED light emitting...

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Bibliographic Details
Main Authors MINAMISAWA HIROSHI, IWASAKO YASUSHI, UENO SUKETSUGU
Format Patent
LanguageEnglish
Published 25.10.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To solve the problems such as heat radiation and thermal expansion in an LED package to make a package into the one by which large light intensity is obtained than in the present one, and to simultaneously suppress costs.SOLUTION: For an LED consisting of: an LED light emitting part having an LED element; an electrode part; and a heat sink part, the problems are solved by using a material mainly containing ceramics with low rigidity ratio and capable of following thermal expansion of the heat sink part for an insulator layer between the electrode part and the heat sink part. The material mainly containing ceramics consists of: a phase of ceramics particles; and an inorganic binder phase which surrounds its surroundings.
Bibliography:Application Number: JP20110074032