TRANSPARENT CONDUCTIVE LAMINATE AND METHOD FOR MANUFACTURING THE SAME

• Main Authors: KUSAKA KAZUHIRO, KAMIOKA TAKENORI, WATANABE OSAMU, ASAI NOBUKI
• Format: Patent
• Language: English
• Published: 25.10.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CABLES; CALCULATING; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; COMPUTING; CONDUCTORS; COUNTING; ELECTRIC DIGITAL DATA PROCESSING; ELECTRIC SWITCHES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; EMERGENCY PROTECTIVE DEVICES; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PERFORMING OPERATIONS; PHYSICS; PRINTED CIRCUITS; RELAYS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SELECTORS; TRANSPORTING

PROBLEM TO BE SOLVED: To provide transparent conductive laminate in which difference in optical characteristics between a conductive part and a non-conductive part which are patterned is small, and whose bones are invisible, and a method for manufacturing the same with sufficient productivity and at low cost.SOLUTION: In transparent conductive laminate, a transparent resin layer (B) containing a metal system nanowire is provided at least on one side of a transparent base material (A), (B) is patterned to a conductive part (C) and a non-conductive part (D), a silver amount of the non-conductive part by fluorescent X-rays is 0.6-0.8 fold of a silver amount of the conductive part. Furthermore, in a method for manufacturing the transparent conductive laminate, the silver amount of the non-conductive part by the fluorescent X-rays is made into 0.6-0.8 fold of the silver amount of the conductive part by forming a transparent conductive layer by applying solution containing the metal system nanowire on one side of the transparent base material (A) and drying the solution, performing patterning by resist to the transparent resin layer (B) cured by performing light irradiation after applying photocuring type acrylic resin solution on the transparent conductive layer and drying the solution, etching a resist opening at 30°C or higher and 60°C or lower by acid etching liquid which is mixture of hydrochloric acid and nitric acid, has the weight ratio of hydrogen chloride/nitric acid of 25/1-3/1, and has the acid concentration by adding hydrogen chloride and nitric acid of 17 wt.% or higher, to be patterned to the conductive part (C) and the non-conductive part (D).