WIRING BOARD

• Main Author: HIRAOKA TETSUYA
• Format: Patent
• Language: English
• Published: 18.10.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To inhibit propagation of cracks occurred in an insulation layer of a wiring board without deteriorating electric characteristics of wiring arranged in each layer of the wiring board.SOLUTION: The wiring board comprises first wiring, second wiring, third wiring, fourth wiring, and an insulation layer. In a thickness direction of the wiring board, the first wiring and the fourth wiring do not overlap with each other. In the thickness direction of the wiring board, the second wiring and the third wiring do not overlap with each other. A hill and a trough are provided on a lateral face of the first wiring in a region where the first wiring and the second wiring are adjacent to each other. A hill and a trough are provided on a lateral face of the second wiring in a region where the first wiring and the second wiring are adjacent to each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the first wiring and the third wiring overlap with each other. In the thickness direction of the wiring board, the trough provided on the lateral face of the second wiring and the fourth wiring overlap with each other.