POWER SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a power semiconductor device having a thermally conductive insulating resin layer in which thermal conductivity is ensured stably and good electric insulation is also ensured by minimizing voids.SOLUTION: The power semiconductor device comprises a power module config...

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Bibliographic Details
Main Authors NAKAJIMA YASUSHI, BETSUSHIBA NORIYUKI
Format Patent
LanguageEnglish
Published 10.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a power semiconductor device having a thermally conductive insulating resin layer in which thermal conductivity is ensured stably and good electric insulation is also ensured by minimizing voids.SOLUTION: The power semiconductor device comprises a power module configured by solder joining a semiconductor element and a metal wiring member, and covering them with a mold resin so that at least one surface of a metal wiring member is exposed to the surface, a heat sink arranged to face the power module surface of the metal wiring member on the exposed surface side, a thermally conductive insulating resin sheet provided between the power module and the heat sink, a sheet thickness regulation member provided at least on one side of the power module and the heat sink and regulating the thickness of the thermally conductive insulating resin sheet, and an insulating sheet volume increment/decrement absorption part provided near the peripheral part of the thermally conductive insulating resin sheet.
Bibliography:Application Number: JP20110036918