DIE BONDER AND SEMICONDUCTOR MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a highly reliable die bonder capable of accurately bonding a die, and a semiconductor manufacturing method.SOLUTION: The die bonder according to the present invention includes: a bonding head for sucking a die from a wafer and bonding it to a substrate; a positioning...

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Bibliographic Details
Main Authors KISHI YOSHIAKI, KIHARA MASAMICHI
Format Patent
LanguageEnglish
Published 10.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a highly reliable die bonder capable of accurately bonding a die, and a semiconductor manufacturing method.SOLUTION: The die bonder according to the present invention includes: a bonding head for sucking a die from a wafer and bonding it to a substrate; a positioning mechanism having a first adjusting mechanism for positioning the die with prescribed accuracy and positioning the bonding head; a positioning control part for controlling the positioning mechanism; and a second adjusting mechanism provided in the bonding head, for adjusting the position of the die with accuracy higher than that of the first adjusting mechanism.
Bibliography:Application Number: JP20110032881