COIL COMPONENT

PROBLEM TO BE SOLVED: To make thickness of a coil component thin by suppressing the number of total layers of the coil component, and to suppress the generation rate of defective products.SOLUTION: A first coil 50 and a second coil 60 are provided on wiring layers 30 and 40 which are upper and lower...

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Bibliographic Details
Main Authors FUKUNAGA TAKAYUKI, HOSHI KAZUSHI
Format Patent
LanguageEnglish
Published 06.09.2012
Subjects
BASIC ELECTRIC ELEMENTS
BASIC ELECTRONIC CIRCUITRY
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
INDUCTANCES
MAGNETS
RESONATORS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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Summary:PROBLEM TO BE SOLVED: To make thickness of a coil component thin by suppressing the number of total layers of the coil component, and to suppress the generation rate of defective products.SOLUTION: A first coil 50 and a second coil 60 are provided on wiring layers 30 and 40 which are upper and lower two layers. The first coil 50 and the second coil 60 respectively have upper layer side spiral wirings 51 and 61 formed on the upper side wiring layer 30, and lower layer side spiral wirings 52 and 62 formed on the lower side wiring layer 40. An inner peripheral side end portion of the upper layer side spiral wiring 51 of the first coil 50, and an inner peripheral side end portion of the lower layer side spiral wiring 52 are connected through one first via hole 55, and an inner peripheral side end portion of the upper layer side spiral wiring 61 of the second coil 60 and an inner peripheral side end portion of the lower layer side spiral wiring 62 are connected through one second via hole 65.
Bibliography:Application Number: JP20110028426