METHOD FOR MANUFACTURING PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC APPARATUS AND RADIO-CONTROLLED TIMEPIECE

• Main Author: FUNABIKI YOICHI
• Format: Patent
• Language: English
• Published: 23.08.2012
• Subjects: BASIC ELECTRIC ELEMENTS; BASIC ELECTRONIC CIRCUITRY; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION OF NOISE BY SUCH CIRCUITS; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To form through electrodes with a minimum fraction defective while suppressing warping, cracking or other incidents of a base substrate, and manufacture a package productively.SOLUTION: A method for manufacturing a package is provided in which a through electrode forming step includes the steps of: forming through holes 30, 31 through a base substrate 40; disposing core portions 7b of rivets 7 in the through holes and abutting head portions 7a to one surface 40b of the base substrate; releasably attaching a first cover 70 to the base substrate to temporarily fix the rivets; fixing a second cover 80 onto the first cover; filling gaps between the through holes and the core portions with a paste P; releasing the first cover from the base substrate via the second cover; and firing the paste to set it and then removing the head portions. In the fixing step, the second cover is fixed such that one end portion 80a protrudes outward beyond the base substrate, and in the release step, the one end portion is used as a release operation tab.