HIGH-FREQUENCY MODULE

PROBLEM TO BE SOLVED: To provide a high-frequency module which can be reduced in thickness while reducing processes and costs for manufacturing.SOLUTION: The high-frequency module comprises: a component mounted on one surface of a substrate; an electrode for connecting the component formed on the on...

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Bibliographic Details
Main Author MACHIDA YUJI
Format Patent
LanguageEnglish
Published 02.08.2012
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION
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Summary:PROBLEM TO BE SOLVED: To provide a high-frequency module which can be reduced in thickness while reducing processes and costs for manufacturing.SOLUTION: The high-frequency module comprises: a component mounted on one surface of a substrate; an electrode for connecting the component formed on the one surface and a device on which the high-frequency module is to be mounted; and a first insulating layer formed on the one surface so as to cover the component. The electrode is formed so as to be at least partially continuous with the first insulating layer on a surface of the first insulating layer.
Bibliography:Application Number: JP20110006314