COOLING DEVICE FOR DIAMOND-WIRE CUTTING SYSTEM

• Main Authors: LEE PING FENG, LEE CHENG MING
• Format: Patent
• Language: English
• Published: 26.07.2012
• Subjects: BASIC ELECTRIC ELEMENTS; DRESSING OR CONDITIONING OF ABRADING SURFACES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; SEMICONDUCTOR DEVICES; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To provide a cooling device for cutting system further improving the cutting effect of a hard-brittle material by a diamond-wire, and further extending service life of the diamond-wire.SOLUTION: The cooling device includes a liquid tank 4 being a closed space which is formed by being surrounded with a continuous face or a plurality of faces and temporarily retaining and storing cooling liquid. Further, the face or the place between the respective faces which surrounds and forms the liquid tank 4 presents a continued closed state or a semi-opened state and the cutting portion of the diamond-wire 1 cutting the hard-brittle material passes through the liquid tank 4 and is submerged in the cooling liquid at any time. A sorting collector 5 is provided under the liquid tank 4.