METHOD OF CUTTING WORKPIECE

• Main Authors: MORI YUJI, HIKUMA SHINJI, KANAZAWA HIROMICHI, KOZU TSUTOMU
• Format: Patent
• Language: English
• Published: 26.07.2012
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING; WORKING CEMENT, CLAY, OR STONE; WORKING STONE OR STONE-LIKE MATERIALS

PROBLEM TO BE SOLVED: To inhibit the deterioration in cutting accuracy when cutting a plurality of blockish workpieces in a plurality of piles without using an adhesive.SOLUTION: For cutting a plurality of blockish workpieces to be cut by a wire a method of cutting the workpiece includes a preparation step (step S11) of stacking a plurality of piles of the plurality of blockish workpieces, and a cutting step (step S13) of cutting the plurality of blockish workpieces by the wire. During the cutting step, the flexure of the wire is controlled so that, while the first pile of the blockish workpieces is cut, the cutting of the second pile of the blockish workpieces stacked adjacently to the first pile of the blockish workpieces starts.