METHOD OF CUTTING WORKPIECE

PROBLEM TO BE SOLVED: To inhibit the deterioration in cutting accuracy when cutting a plurality of blockish workpieces in a plurality of piles without using an adhesive.SOLUTION: For cutting a plurality of blockish workpieces to be cut by a wire a method of cutting the workpiece includes a preparati...

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Bibliographic Details
Main Authors MORI YUJI, HIKUMA SHINJI, KANAZAWA HIROMICHI, KOZU TSUTOMU
Format Patent
LanguageEnglish
Published 26.07.2012
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
WORKING CEMENT, CLAY, OR STONE
WORKING STONE OR STONE-LIKE MATERIALS
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Summary:PROBLEM TO BE SOLVED: To inhibit the deterioration in cutting accuracy when cutting a plurality of blockish workpieces in a plurality of piles without using an adhesive.SOLUTION: For cutting a plurality of blockish workpieces to be cut by a wire a method of cutting the workpiece includes a preparation step (step S11) of stacking a plurality of piles of the plurality of blockish workpieces, and a cutting step (step S13) of cutting the plurality of blockish workpieces by the wire. During the cutting step, the flexure of the wire is controlled so that, while the first pile of the blockish workpieces is cut, the cutting of the second pile of the blockish workpieces stacked adjacently to the first pile of the blockish workpieces starts.
Bibliography:Application Number: JP20100293903