MOLDED CHIP FABRICATION METHOD AND APPARATUS

PROBLEM TO BE SOLVED: To provide an LED with coating containing a conversion material which allows control of a geometry and a thickness of the coating so as to provide a uniform color temperature regardless of viewing angles as well as consistent reproduction of the same or similar light-emitting c...

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Bibliographic Details
Main Authors ERIC J TARSA, MICHAEL S LEUNG, IBBETSON JAMES
Format Patent
LanguageEnglish
Published 19.07.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide an LED with coating containing a conversion material which allows control of a geometry and a thickness of the coating so as to provide a uniform color temperature regardless of viewing angles as well as consistent reproduction of the same or similar light-emitting characteristics.SOLUTION: An LED 102 comprises a plurality of semiconductor layers and a contact 104 at a top part which is in electrical contact with the semiconductor layers and extends upward from the semiconductor layers. Coating comprising a cured binder and a conversion material which covers and conforms to the semiconductor layers is applied onto the LED 102 to yield a coated LED 122. The contact extends upward through the coating and is exposed to the top surface of the coating for electrical contact.
Bibliography:Application Number: JP20120026326