METHOD OF MANUFACTURING COMPOSITE MATERIAL FOR LEAD FRAME

PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite material for lead frame which allows for provision of a composite material having less variation in thickness and processing at a lower cost.SOLUTION: When manufacturing a composite material 1 composed by sequentially laminating...

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Bibliographic Details
Main Authors KUROKI KAZUMA, TOKUMITSU TETSUYA, HOSONO MASAYUKI, SUZUKI YUKIO
Format Patent
LanguageEnglish
Published 28.06.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL
PERFORMING OPERATIONS
PUNCHING METAL
ROLLING OF METAL
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a method of manufacturing a composite material for lead frame which allows for provision of a composite material having less variation in thickness and processing at a lower cost.SOLUTION: When manufacturing a composite material 1 composed by sequentially laminating three layers of copper or a copper alloy 2, titanium or a titanium alloy 3, and copper or a copper alloy 2, rolling reduction ratio of bonded clad rolling is set at 60% or higher, a rolling reduction ratio of finish rolling to final board thickness is set at 5% or lower, and cold bonded clad rolling and finish rolling are performed in the atmosphere.
Bibliography:Application Number: JP20100271636