POWER SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To provide a power semiconductor module capable of shortening the time required for development and capable of reducing cost required for manufacturing parts.SOLUTION: A power semiconductor module 200 comprises: power semiconductor units 28 including at least insulating substra...

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Bibliographic Details
Main Authors IKEDA YOSHINARI, HORI MOTOHITO
Format Patent
LanguageEnglish
Published 21.06.2012
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Summary:PROBLEM TO BE SOLVED: To provide a power semiconductor module capable of shortening the time required for development and capable of reducing cost required for manufacturing parts.SOLUTION: A power semiconductor module 200 comprises: power semiconductor units 28 including at least insulating substrates 16 on which power semiconductor elements 18 are mounted and have copper plates and insulating plates, a printed board with pins connected to the power semiconductor elements 18, connection terminals connected to the copper plates, and a resin sealing member in which the insulating substrates 16 and the printed board with the pins are sealed therein; and an interface member that electrically connects the connection terminals protruding from the plurality of power semiconductor units 28.
Bibliography:Application Number: JP20100270367