LED MODULE DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: TOYOSHIMA TSUTOMU, MATSUURA YOSHITSUGU, YOKOZAWA SHUNYA, ISHIHARA MASAMICHI
• Format: Patent
• Language: English
• Published: 07.06.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve a heat radiation characteristic of an LED module device.SOLUTION: A wiring board is constituted by a glass epoxy substrate on which wiring is formed. An LED package substrate has a laminated structure that two insulation layers comprising a resin layer and an adhesive layer are sandwiched between a metallic plate and a metal foil. An LED chip is mounted to the LED package substrate, and a pair of electrodes of the LED chip are respectively connected to the metal foils separated by a slit, and filled with a transparent resin, so as to constitute an LED package. The LED package is fastened to or brought into contact with a heat radiator, an upper part of a wall of the LED package is adhered to the glass epoxy substrate, and the pair of the external connection electrodes are connected to the wiring of the glass epoxy substrate on an adhesion part.