PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD FOR THE SAME

• Main Authors: CHO JEUN, YI CHUN-GU, CHON MYUN-MI
• Format: Patent
• Language: English
• Published: 07.06.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

PROBLEM TO BE SOLVED: To provide a printed circuit board and a manufacturing method for the same.SOLUTION: A printed circuit board according to an embodiment of the present invention includes a first circuit pattern provided for a core substrate, an insulation layer stacked on the core substrate so as to cover the first circuit pattern and having uniform nanometer-level surface roughness, a second circuit pattern provided for the insulation layer, and a via pattern formed through the insulation layer for electrically connecting the first circuit pattern and the second circuit pattern to each other.