LED MODULE DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: TOYOSHIMA TSUTOMU, MATSUURA YOSHITSUGU, YOKOZAWA SHUNYA, ISHIHARA MASAMICHI
• Format: Patent
• Language: English
• Published: 07.06.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve a heat radiation characteristic of an LED module device.SOLUTION: An LED package substrate has a laminated structure that two insulation layers comprising a resin layer and an adhesive layer are sandwiched between a metallic plate and a metal foil. A slit is opened o...