LED MODULE DEVICE AND MANUFACTURING METHOD THEREOF

• Main Authors: TOYOSHIMA TSUTOMU, MATSUURA YOSHITSUGU, YOKOZAWA SHUNYA, ISHIHARA MASAMICHI
• Format: Patent
• Language: English
• Published: 07.06.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve a heat radiation characteristic of an LED module device.SOLUTION: An LED package substrate has a laminated structure that two insulation layers comprising a resin layer and an adhesive layer are sandwiched between a metallic plate and a metal foil. A slit is opened on the metal foil so that the metal foil at an upper end of a wall formed by bending functions as a pair of external connection electrodes, and ends of the pair of the external connection electrodes are arranged inside the metallic plate end. An LED chip is mounted to the LED package substrate, and a pair of electrodes of the LED chip are respectively connected to the metal foils separated by the slit, and filled with a transparent resin, so as to constitute an LED package. The LED package is mounted to a wiring board, so that the pair of the external connection electrodes are connected to the wiring on the wiring board, and the LED package substrate is fastened to or brought into contact with a heat radiator.