SUPPORTING SUBSTRATE FOR CIRCUIT FORMATION, AND METHOD OF MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT

• Main Authors: KAWAKAMI YUTAKA, TSUBOMATSU YOSHIAKI, SAKURAI TAKEHISA, SUGIBAYASHI MANABU, TAMURA TADASHI
• Format: Patent
• Language: English
• Published: 24.05.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To improve a package substrate and a method of manufacturing the same.SOLUTION: A core substrate 1 is obtained by arranging copper foils 3 having a size smaller than that of a copper-clad lamination plate 2 on both sides of the copper-clad lamination plate 2, and the substrate is defined as a first circuit substrate 10. Next, an insulation resin layer 4 and a copper foil 5 to be an outer layer are laminated on an adhesion structure. This substrate is defined as a second circuit substrate 20. A conformal mask is formed on the copper foil 5 to obtain a third circuit substrate 30. A non-penetrating hole is formed to obtain a forth circuit substrate 40. The non-penetrating hole is plated with copper and brought into conduction to obtain a fifth circuit substrate 50. The copper-clad lamination plate 2 as a supporting body is removed by cutting the fifth circuit substrate 50 so as to have a size smaller than that of the copper foil 3 to obtain a sixth circuit substrate 60. The wires are etched to obtain a seventh circuit substrate 70. Solder resist formation and gold plating finishing are performed to obtain an eighth circuit substrate 80.