MANUFACTURING METHOD OF WIRING BOARD

PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without depending on a width or a diameter (area) of the groove when manufacturing a wiring board having at least one conductor layer and one resin insul...

Full description

Saved in:
Bibliographic Details
Main Authors NISHIO KENJI, SATO HIRONORI, IZUMI MASARO, MURAMATSU MASAKI, YAMADA ERINA
Format Patent
LanguageEnglish
Published 24.05.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online AccessGet full text

Cover

Abstract PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without depending on a width or a diameter (area) of the groove when manufacturing a wiring board having at least one conductor layer and one resin insulation layer.SOLUTION: A manufacturing method of a wiring board formed by laminating at least one conductor layer and one resin insulation layer includes a groove formation process in which a groove is formed on a main surface side of the resin insulation layer and Cu paste supply process in which a Cu paste is supplied on the groove and the main surface of the resin insulation layer and the conductor layer is formed with the Cu paste.
AbstractList PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without depending on a width or a diameter (area) of the groove when manufacturing a wiring board having at least one conductor layer and one resin insulation layer.SOLUTION: A manufacturing method of a wiring board formed by laminating at least one conductor layer and one resin insulation layer includes a groove formation process in which a groove is formed on a main surface side of the resin insulation layer and Cu paste supply process in which a Cu paste is supplied on the groove and the main surface of the resin insulation layer and the conductor layer is formed with the Cu paste.
Author SATO HIRONORI
YAMADA ERINA
MURAMATSU MASAKI
IZUMI MASARO
NISHIO KENJI
Author_xml – fullname: NISHIO KENJI
– fullname: SATO HIRONORI
– fullname: IZUMI MASARO
– fullname: MURAMATSU MASAKI
– fullname: YAMADA ERINA
BookMark eNrjYmDJy89L5WRQ8XX0C3VzdA4JDfL0c1fwdQ3x8HdR8HdTCPcECzj5Owa58DCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDIwNLS3MzC0djohQBAKZbJTc
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID JP2012099768A
GroupedDBID EVB
ID FETCH-epo_espacenet_JP2012099768A3
IEDL.DBID EVB
IngestDate Fri Jul 19 11:43:26 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_JP2012099768A3
Notes Application Number: JP20100248562
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120524&DB=EPODOC&CC=JP&NR=2012099768A
ParticipantIDs epo_espacenet_JP2012099768A
PublicationCentury 2000
PublicationDate 20120524
PublicationDateYYYYMMDD 2012-05-24
PublicationDate_xml – month: 05
  year: 2012
  text: 20120524
  day: 24
PublicationDecade 2010
PublicationYear 2012
RelatedCompanies NGK SPARK PLUG CO LTD
RelatedCompanies_xml – name: NGK SPARK PLUG CO LTD
Score 2.8536928
Snippet PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Title MANUFACTURING METHOD OF WIRING BOARD
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20120524&DB=EPODOC&locale=&CC=JP&NR=2012099768A
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMbc0TQT2uIA5Ddg8BnZQUsx1Ew0NLHWBHZYUE2ALxdIUfNehr5-ZR6iJV4RpBBNDNmwvDPic0HLw4YjAHJUMzO8l4PK6ADGI5QJeW1msn5QJFMq3dwuxdVGD9o4NjQyAZqu5ONm6Bvi7-DurOTvbegWo-QVB5CyBda-FIzMDK7AdbQ5a_-Ua5gTallKAXKe4CTKwBQCNyysRYmBKzRNm4HSGXb0mzMDhC53xBjKhma9YhEHF19Ev1M3ROSQUtIJBwdc1xMPfRcHfTSHcEyzg5O8Y5CLKoOTmGuLsoQu0Lh7uuXivACSnGYsxsAB7_akSDAqWwLrX1DItLRHYQjJJMUqzME02trAws7QwSgWqTTKVZJDGY5AUXllpBi4QDzQJbmQiw8BSUlSaKgusW0uS5MBhAgAkOHa5
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwY2BQMbc0TQT2uIA5Ddg8BnZQUsx1Ew0NLHWBHZYUE2ALxdIUfNehr5-ZR6iJV4RpBBNDNmwvDPic0HLw4YjAHJUMzO8l4PK6ADGI5QJeW1msn5QJFMq3dwuxdVGD9o4NjQyAZqu5ONm6Bvi7-DurOTvbegWo-QVB5CyBda-FIzMDK5CyAB207xrmBNqWUoBcp7gJMrAFAI3LKxFiYErNE2bgdIZdvSbMwOELnfEGMqGZr1iEQcXX0S_UzdE5JBS0gkHB1zXEw99Fwd9NIdwTLODk7xjkIsqg5OYa4uyhC7QuHu65eK8AJKcZizGwAHv9qRIMCpbAutfUMi0tEdhCMkkxSrMwTTa2sDCztDBKBapNMpVkkMZjkBReWXkGTo8QX594H08_b2kGLpAMaELcyESGgaWkqDRVFljPliTJgcMHANz9eak
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=MANUFACTURING+METHOD+OF+WIRING+BOARD&rft.inventor=NISHIO+KENJI&rft.inventor=SATO+HIRONORI&rft.inventor=IZUMI+MASARO&rft.inventor=MURAMATSU+MASAKI&rft.inventor=YAMADA+ERINA&rft.date=2012-05-24&rft.externalDBID=A&rft.externalDocID=JP2012099768A