MANUFACTURING METHOD OF WIRING BOARD

PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without depending on a width or a diameter (area) of the groove when manufacturing a wiring board having at least one conductor layer and one resin insul...

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Bibliographic Details
Main Authors NISHIO KENJI, SATO HIRONORI, IZUMI MASARO, MURAMATSU MASAKI, YAMADA ERINA
Format Patent
LanguageEnglish
Published 24.05.2012
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:PROBLEM TO BE SOLVED: To provide a new manufacturing method which forms a conductor layer uniformly in a groove formed on a resin insulation layer without depending on a width or a diameter (area) of the groove when manufacturing a wiring board having at least one conductor layer and one resin insulation layer.SOLUTION: A manufacturing method of a wiring board formed by laminating at least one conductor layer and one resin insulation layer includes a groove formation process in which a groove is formed on a main surface side of the resin insulation layer and Cu paste supply process in which a Cu paste is supplied on the groove and the main surface of the resin insulation layer and the conductor layer is formed with the Cu paste.
Bibliography:Application Number: JP20100248562