PRINT SOLDER INSPECTION APPARATUS AND PRINT SOLDER INSPECTION METHOD

• Main Authors: TAKADA OSAMU, MICHAL PAVLOVSKY, SUGAI MASAYA, YAGAWA MAKOTO
• Format: Patent
• Language: English
• Published: 24.05.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; PRINTED CIRCUITS; TESTING

PROBLEM TO BE SOLVED: To provide a technology for preventing influences of a processing portion for division which is processed for dividing a printed circuit board after component mounting, when setting a reference surface which becomes a reference of a hight, to a solder point to be measured on the printed circuit board and determining a height of a solder with respect to the reference surface.SOLUTION: A displacement sensor optically measures a printed circuit board on which a solder is printed and outputs displacement information indicating a displacement in a height of the printed circuit board, and a dividing line determination section detects a processing portion for division for dividing the printed circuit board on the basis of the displacement information and outputs a dividing line of the printed circuit board as dividing line information. Reference surface calculation area setting means sets a reference surface calculation area within an area inside the dividing line upon receiving the dividing line information, and reference surface calculation means sets a plane which is formed in the reference surface calculation area, as a reference surface on the basis of the displacement information within the reference surface calculation area. A displacement measuring section calculates a height of the solder at a solder point from the displacement information of the solder point and the set reference surface.