HEAT RADIATION BASE

PROBLEM TO BE SOLVED: To provide a heat radiation base which has an inexpensive structure and transmits heat generated from electronic components mounted thereon to a metal plate more effectively compared to a conventional heat radiation base.SOLUTION: A heat radiation base for mounting an electroni...

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Bibliographic Details
Main Author CHEN KUEI-FANG
Format Patent
LanguageEnglish
Published 10.05.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a heat radiation base which has an inexpensive structure and transmits heat generated from electronic components mounted thereon to a metal plate more effectively compared to a conventional heat radiation base.SOLUTION: A heat radiation base for mounting an electronic component 3 is composed of a metal plate 4 having a first area 411 and a second area 412 formed on a surface thereof so as to be independent of each other, an insulation layer 5 formed on only a surface of the second area, and a first conductive layer 61 and a second conductive layer 62 which are formed on a surface of the insulation layer.
Bibliography:Application Number: JP20110269739