METHOD FOR TREATING SURFACE OF COPPER

• Main Authors: INOUE FUMIO, SAKAYORI KAZUHIKO, YAMASHITA TOMOAKI, HIROYAMA YUKIHISA
• Format: Patent
• Language: English
• Published: 26.04.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

PROBLEM TO BE SOLVED: To provide a method for treating the surface of a conductive base material for semiconductor packaging, which has satisfactory adhesive properties with a sealing material or the like, can suppress deterioration in electrical properties and heat dissipation, can be subjected to low temperature treatment, has excellent productivity, and is hard to be attached with marks such as cracks and rubbing.SOLUTION: The method for treating the surface of copper includes a roughening process of contacting a chemical roughening liquid containing a corrosion inhibitor, sulfuric acid and hydrogen peroxide to form a roughened shape on the surface of copper. The corrosion inhibitor contains 1,2,3-benzotriazole and 5-amino-1H-tetrazole. The method for treating the surface of copper includes a film removing process of removing an organic film formed on the surface in the roughening process, by bringing the organic film into contact with an alkaline solution containing amine and an alkali metal compound selected from sodium hydroxide and potassium hydroxide, after the roughening process.