MANUFACTURING METHOD FOR PRINTED BOARD

• Main Author: KAMIKAWA HIROSHI
• Format: Patent
• Language: English
• Published: 12.04.2012
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; COMPOSITIONS BASED THEREON; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PRINTED CIRCUITS; THEIR PREPARATION OR CHEMICAL WORKING-UP

PROBLEM TO BE SOLVED: To provide a manufacturing method for printed board, capable of achieving high quality, high productivity and high workability by coating a photosensitive composition with a roll coater without drying distortion (coating unevenness of coating layer from a microscopic viewpoint and warp of printed board from a macroscopic viewpoint) and without coating streaks (roll trace) and liquid sagging.SOLUTION: The manufacturing method for printed board includes a process of forming a coating layer by coating a printed board with coating liquid containing at least polyurethane resin, elastomer, polymerizable compound, photoinitiator, thermal crosslinking agent and filler, using a roll coaster.