APPARATUS AND METHOD FOR PLATING

PROBLEM TO BE SOLVED: To provide a method and apparatus for plating which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions.SOLUTION: The...

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Bibliographic Details
Main Authors UCHIDA TOMOYA, MAYAMA KEIJI
Format Patent
LanguageEnglish
Published 05.04.2012
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:PROBLEM TO BE SOLVED: To provide a method and apparatus for plating which do not require preparation of a separate treatment tank for each treatment step and therefore enable the facility to be reduced in size and, further, which can reduce the amounts of use of the treatment solutions.SOLUTION: The plating apparatus 1 feeds a plating solution to a treatment tank 10 in which an electrode 11 is arranged and plates a workpiece 15 made of a metal so as to perform plating. The plating apparatus includes: a plurality of pipes 22a which are connected to an outer wall 20 of the treatment tank 10; and a switch valve 30 which is provided able to rotate at an inner side of the outer wall 20 and which has at least one feed port 31 for making at least one pipe selected from the plurality of pipes communicate with the treatment tank 10.
Bibliography:Application Number: JP20100213944