INJECTION MOLDING METHOD AND APPARATUS

• Main Author: TAKAMURA KEIJI
• Format: Patent
• Language: English
• Published: 05.04.2012
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To perform mold forming without damaging a substrate by clamping the substrate with an adequate mold clamping load.SOLUTION: This apparatus includes a mold 100, a mold clamping mechanism 110 and an injection mechanism 120, inserts the substrate 10 mounted with an electronic component 7 between divided faces of the mold, clamps the substrate 10 with a mold clamping load FO at which the mold is closed and clamped, and injects molding resin 2 into a cavity 17 formed between the divided faces of the mold 100, thereby performs resin molding of the electronic component 7 mounted on the substrate 10. The injection molding apparatus further includes: a mold clamping load measuring instrument 13; an injection load measuring instrument 5 for measuring an injection load F2 in a direction opposite from the mold clamping load F0 corresponding to injection pressure acting on the mold when the mold is closed and the injection resin is injected into the cavity; and a control means for controlling the mold clamping load F0 within the tolerable range based on the measured data by the mold clamping load measuring instrument 13 and the measured data by the injection load measuring instrument 5.