PRESSURE-SENSITIVE ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape generating little contamination to an adherend, attaining compatibility between adhesive power and peelability, and producible by coextrusion molding.SOLUTION: The pressure-sensitive adhesive tape includes a pressure-sensitive adhes...

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Main Authors TORII TADAO, OYAMA TAKATERU, HABU TSUYOSHI, ASAI FUMITERU, KATO YUKI, TAKAHASHI TOMOKAZU, IKUSHIMA NOBUSUKE, KAMEI KATSUTOSHI
Format Patent
LanguageEnglish
Published 29.03.2012
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
POLISHES
USE OF MATERIALS AS ADHESIVES
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Summary:PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive tape generating little contamination to an adherend, attaining compatibility between adhesive power and peelability, and producible by coextrusion molding.SOLUTION: The pressure-sensitive adhesive tape includes a pressure-sensitive adhesive layer and a base material layer, wherein: the pressure-sensitive adhesive layer contains an amorphous propylene-(1-butene) copolymer polymerized by using a metallocene catalyst; a weight-average molecular weight (Mw) of the propylene-(1-butene) copolymer is ≥200,000; a molecular weight distribution (Mw/Mn) of the propylene-(1-butene) copolymer is ≤2; and the base material layer contains an ethylene-vinyl acetate copolymer.
Bibliography:Application Number: JP20100207827