METHOD FOR FORMING WAFER FOR USE IN OPTICAL PART AND OPTICAL PART INCORPORATING SUCH WAFER

• Main Authors: SIDHU JOTINDERPAL, BALCH THOMAS A
• Format: Patent
• Language: English
• Published: 22.03.2012
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CONTACT LENSES; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS; OPTICS; PERFORMING OPERATIONS; PHYSICS; PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCESIN A PLASTIC STATE; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SPECTACLES; SUNGLASSES OR GOGGLES INSOFAR AS THEY HAVE THE SAME FEATURESAS SPECTACLES; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

PROBLEM TO BE SOLVED: To provide an improved method for forming a wafer into a complex, curved shape, for use in an optical part.SOLUTION: The method includes a step of moving the wafer into contact with a molding surface having a predetermined non-cylindrical, aspheric curved shape, to form the wafer into a corresponding shape. The step of moving is sufficient, by itself, to form the wafer into the desired non-cylindrical, aspheric curved shape, without the need for additional forming steps.