DISSIPATION OF HEAT FROM CIRCUIT BOARD ON WHICH BARE SILICON CHIP IS MOUNTED

• Main Authors: CHRISTINE LI BOGZ, SITTLER BENJAMIN L, SCHOENSTEIN PAUL G, REAMEY ROBERT H
• Format: Patent
• Language: English
• Published: 15.03.2012
• Subjects: ADHESIVES; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; POLISHES; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide a heat dissipation device for a circuit board on which a bare silicon chip having an exposed surface is mounted.SOLUTION: A heat dissipation body 16 has a flat portion 18, with a pad 22 comprising one or more gel compositions 23 fitted on its inside surface 20 (facing a circuit board 12). The pad 22 is positioned on the side opposed to a bare silicon pad when the heat dissipation body 16 is attached to the circuit board 12 to totally cover an exposure surface 25 of a chip 14. The gel composition 23 has an aggregation force higher than a viscosity force, a compression factor smaller than 1.38 Mpa, heat conductivity higher than 1.0 W/m-°C, and a thickness between 0.08 mm and 1.0 mm. The low compression factor of the gel material protects the chip 14 from transmission of a mechanical stress to the chip.