EQUIPMENT AND METHOD FOR MANUFACTURING DEVICE

• Main Authors: HARAICHI SATOSHI, ISHIBASHI AKIRA, HARA SHIRO
• Format: Patent
• Language: English
• Published: 15.03.2012
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

PROBLEM TO BE SOLVED: To provide equipment and a method for manufacturing a device, capable of flexibly dealing with variation in kind and amount of the device in a manufacturing line.SOLUTION: A method and equipment for manufacturing a device by a single-wafer-processing method using a 0.5 inch sized wafer are provided. The method in which a manufacturing line is formed by arranging a plurality of closed type unit processing equipment 1 movable and preferably having a standardized outer shape, for processing one processing process in a manufacturing process, comprises: when the number of the manufacturing units of the device is greater than that of the unit processing equipment, arranging the unit processing equipment by a flow shop method in which the equipment is arranged according to the order of the processing process of the device; when the number of the manufacturing units of the device is similar to that of the unit processing equipment, arranging the unit processing equipment by a class shop method in which the equipment is classified and arranged according to each large classification of the order of the process; and when the number of the manufacturing units is substantially less than that of the processes, arranging the unit processing equipment by a multi cell shop method in which about one of the unit processing equipment for one kind of process kinds is arranged in a cell and the plurality of cells are arranged.