COMPOSITION FOR POLISHING AND METHOD OF POLISHING

PROBLEM TO BE SOLVED: To provide a composition for polishing that can be used suitably in a polishing process to form a wiring of a semiconductor device and to provide a method of polishing using the composition for polishing.SOLUTION: A composition for polishing in this invention includes a water-s...

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Bibliographic Details
Main Authors TAMADA SHUICHI, IZAWA YOSHIHIRO, UMEDA TAKEHIRO, TSUNODA KAZUYA, HIRANO TATSUHIKO
Format Patent
LanguageEnglish
Published 23.02.2012
Subjects
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DRESSING OR CONDITIONING OF ABRADING SURFACES
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
PERFORMING OPERATIONS
POLISHES
POLISHING
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:PROBLEM TO BE SOLVED: To provide a composition for polishing that can be used suitably in a polishing process to form a wiring of a semiconductor device and to provide a method of polishing using the composition for polishing.SOLUTION: A composition for polishing in this invention includes a water-soluble polymer, a polishing accelerator and an oxidizer. The water-soluble polymer is a polyamide-polyamine polymer having an amine value of 150 mgKOH/1 g solid or higher.
Bibliography:Application Number: JP20100178613