CONDUCTIVE SILVER PASTE, METHOD FOR FORMING CONDUCTIVE PATTERN, AND PRINTED MATTER WITH CONDUCTIVE PATTERN

PROBLEM TO BE SOLVED: To provide a conductive silver paste with which a conductive pattern with excellent adhesion to a substrate can be obtained within a short time of 10 minutes even at a low temperature below 150°C.SOLUTION: The conductive silver paste contains silver particles (A) with a median...

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Bibliographic Details
Main Authors OKAMOTO TOMOKO, KATAYAMA YOSHINORI, YOSHIHARA SUNAO, SENTE YASUHIRO
Format Patent
LanguageEnglish
Published 23.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
CABLES
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CONDUCTORS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INSULATORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
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Summary:PROBLEM TO BE SOLVED: To provide a conductive silver paste with which a conductive pattern with excellent adhesion to a substrate can be obtained within a short time of 10 minutes even at a low temperature below 150°C.SOLUTION: The conductive silver paste contains silver particles (A) with a median size (D50) in the range of 0.2 to 0.9 μm, a vinyl chloride-vinyl acetate copolymer (B) containing 3 to 9 wt.% of copolymerization units of vinyl alcohol and/or (meth-) acrylic acid hydroxyalkyl ester in the copolymer, and an organic compound (C) which dissolves the copolymer (B), does not show reactivity with the copolymer(B), and is in a liquid state at 25°C, as essential components. A conductive pattern is formed by printing with the conductive silver paste on a substrate, and a printed matter with the conductive pattern is formed by a method for forming the conductive pattern.
Bibliography:Application Number: JP20100178538