SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To eliminate the use of a bus bar, to which a positive electrode terminal and a negative electrode terminal are joined, in a semiconductor device in which multiple pieces of semiconductor packaging are laminated.SOLUTION: A positive electrode 21 is extended to an end part of a...

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Bibliographic Details
Main Authors IDE SHIGEO, IWADE TOMOO
Format Patent
LanguageEnglish
Published 16.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To eliminate the use of a bus bar, to which a positive electrode terminal and a negative electrode terminal are joined, in a semiconductor device in which multiple pieces of semiconductor packaging are laminated.SOLUTION: A positive electrode 21 is extended to an end part of a case 19 in the laminating direction X. This structure allows the positive electrodes 21 of the adjacent semiconductor packaging 1 to come in contact with each other and are electrically connected when multiple pieces of the semiconductor packaging 1 are laminated.
Bibliography:Application Number: JP20110041854