SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which increases freedom in routing of a low-current wiring part.SOLUTION: The semiconductor device comprises an insulation base material, a wiring part provided at the insulation base material and a semiconductor chip 30 in which a power transi...

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Bibliographic Details
Main Author OKURA YASUTSUGU
Format Patent
LanguageEnglish
Published 09.02.2012
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a semiconductor device which increases freedom in routing of a low-current wiring part.SOLUTION: The semiconductor device comprises an insulation base material, a wiring part provided at the insulation base material and a semiconductor chip 30 in which a power transistor is formed and sealed in the insulation base material. The wiring part is provided with a high-current wiring part (an emitter terminal 41, a collector terminal 42, an interlayer connection part 60) including a conductor layer electrically connected to high-current electrodes (an emitter electrode 32, a collector electrode 33) of the semiconductor chip 30 and facing the high-current electrodes, and a low-current wiring part including a conductor pattern 50 electrically connected to a low-current electrodes (sensor electrodes 361, 362, a gate electrode) of the semiconductor chip 30 and insulated from the high-current wiring part by the insulation base material and the interlayer connection part 60.
Bibliography:Application Number: JP20100168473