RESIN COMPOSITION, METAL FOIL WITH RESIN, AND METAL BASE SUBSTRATE

PROBLEM TO BE SOLVED: To provide a resin composition which excels in adhesion with a metal base plate and heat cycle nature, and has sufficient insulation resistance without using an acrylic rubber, a silicone resin or the like, and to provide a metal with a resin, and a metal base substrate.SOLUTIO...

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Bibliographic Details
Main Author TOBISAWA AKIHIKO
Format Patent
LanguageEnglish
Published 09.02.2012
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Summary:PROBLEM TO BE SOLVED: To provide a resin composition which excels in adhesion with a metal base plate and heat cycle nature, and has sufficient insulation resistance without using an acrylic rubber, a silicone resin or the like, and to provide a metal with a resin, and a metal base substrate.SOLUTION: The resin composition includes (A) a phenoxy resin which has a bisphenol S skeleton, (B) an inorganic filler, and (C) a silane coupling agent as indispensable components, and the resin composition is characterized in that (C) the silane coupling agent is 2-10% by weight of the whole resin composition.
Bibliography:Application Number: JP20100168580