THERMOSETTING COMPOSITION AND ITS APPLICATION

• Main Authors: MOROKOSHI SHINTA, OKAMOTO FUKI, ANRAKU HIROSHI, SUGIHARA KATSUYUKI
• Format: Patent
• Language: English
• Published: 09.02.2012
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COLOUR PRINTING; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; LINING MACHINES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; PERFORMING OPERATIONS; POLISHES; PRINTED CIRCUITS; PRINTING; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; STAMPS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; TYPEWRITERS; USE OF MATERIALS THEREFOR; WOODSTAINS

PROBLEM TO BE SOLVED: To provide a thermosetting composition capable of forming a polyimide film which exhibits good adhesion to a substrate in printed wiring board application or semiconductor application.SOLUTION: The thermosetting composition includes: (A) at least one carboxyl group-containing compound selected from (i) an amide acid obtained by reacting an amino compound (a1) represented by general formula (1) (wherein Z is a divalent organic group) with an acid anhydride (a2), and (ii) an ester compound obtained by reacting the amide acid or its imidation product with an acid anhydride (a2'); and (B) an epoxy compound.