MODULE AND PORTABLE TERMINAL

PROBLEM TO BE SOLVED: To provide a module and a portable terminal capable of shielding an electronic component sealed by a mold resin and coated by a shield conductor film per circuit block.SOLUTION: A shield conductor wall is formed between circuit blocks by mounting a plurality of conductor compon...

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Bibliographic Details
Main Authors TSUKAMOTO SOTARO, INAGAKI EIGO
Format Patent
LanguageEnglish
Published 26.01.2012
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:PROBLEM TO BE SOLVED: To provide a module and a portable terminal capable of shielding an electronic component sealed by a mold resin and coated by a shield conductor film per circuit block.SOLUTION: A shield conductor wall is formed between circuit blocks by mounting a plurality of conductor components 16 on a top face of a circuit board 10. Each of the conductor components 16 is electrically connected to a solid ground 19 in an inner layer of the circuit board 10 via a ground pad 17 and a via through hole 18 formed on the circuit board 10. The conductor components 16 can also be made conductive with a shield conductor film 21 by exposing them from a top surface of a mold resin 20 and coating their surfaces with the shield conductor film 21. This enables the conductor components 16 to electromagnetically shield the portion between the circuit blocks, thereby preventing a crosstalk between the circuit blocks and characteristic deterioration caused by EMC radiation noise.
Bibliography:Application Number: JP20100155903