PHOSPHORUS-CONTAINING CURING AGENT, EPOXY RESIN COMPOSITION, PREPREG, RESIN FILM WITH SUPPORT, METAL FOIL-CLAD LAMINATE AND MULTILAYER PRINTED WIRING BOARD

• Main Authors: YANAGIDA MAKOTO, AITSU SHUJI
• Format: Patent
• Language: English
• Published: 19.01.2012
• Subjects: ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAININGELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN,SULFUR, SELENIUM OR TELLURIUM; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; ORGANIC CHEMISTRY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

PROBLEM TO BE SOLVED: To provide a phosphorus-containing curing agent capable of providing an epoxy resin composition imparted with properties including high heat resistance, flame retardancy and water resistance; and to provide an epoxy resin composition, a prepreg, a resin film with a support, a metal foil-clad laminate and a multilayer printed wiring board for a printed wiring board and using the curing agent.SOLUTION: The phosphorus-containing curing agent is obtained by reacting a compound A represented by chemical formula (1) with a compound B having a phenolic hydroxyl group. In the formula, Rdenotes a 0-6C hydrocarbon group, and here, the hydrocarbon group having no carbon atoms in Rrefers to a direct bond of Cl to P. There are also provided an epoxy resin composition, a prepreg, a resin film with a support, a metal foil-clad laminate and a multilayer printed wiring board using the curing agent.