SEMICONDUCTOR MODULE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a semiconductor module manufacturing method for preventing refrigerant emissions caused by the gap of a resin mold portion.SOLUTION: The semiconductor module manufacturing method comprises the steps of forming a thermoplastic resin mold part 2 before forming a thermo...

Full description

Saved in:
Bibliographic Details
Main Authors HIRAIWA NAOKI, ARAI TAKESHI, NORITAKE CHIKAGE
Format Patent
LanguageEnglish
Published 12.01.2012
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:PROBLEM TO BE SOLVED: To provide a semiconductor module manufacturing method for preventing refrigerant emissions caused by the gap of a resin mold portion.SOLUTION: The semiconductor module manufacturing method comprises the steps of forming a thermoplastic resin mold part 2 before forming a thermosetting resin mold part 21 when forming a resin mold part 20 of a unit 10 included in the semiconductor module 1, and forming the thermosetting resin mold part 21. Accordingly, adhesiveness between the thermosetting resin mold part 21 and the thermoplastic resin mold part 22 can be heightened owing to adhesiveness of the thermosetting resin before hardening, thereby clearing the gap at the boundary between the thermosetting resin mold part 21 and the thermoplastic resin mold part 22. Consequently, refrigerant emissions through the boundary can be prevented.
Bibliography:Application Number: JP20100143059