POSITIONAL SHIFT DETECTOR FOR LAMINATED SUBSTRATE AND SEMICONDUCTOR MANUFACTURING DEVICE USING THE SAME, AND POSITIONAL SHIFT DETECTION METHOD FOR LAMINATED SUBSTRATE
PROBLEM TO BE SOLVED: To collectively determine a shift amount of a substrate center position, for a laminated substrate composed of two sets of vertically layered discoidal substrates, in element forming or the like.SOLUTION: Contour measurement means 3A detects a contour shape of two sets of super...
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Format | Patent |
Language | English |
Published |
12.01.2012
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Abstract | PROBLEM TO BE SOLVED: To collectively determine a shift amount of a substrate center position, for a laminated substrate composed of two sets of vertically layered discoidal substrates, in element forming or the like.SOLUTION: Contour measurement means 3A detects a contour shape of two sets of superposed substrates 21, 22 from a projection image of a laminated substrate 2 in a thickness direction, while edge shape measurement means 4 detects respective edge shapes of the two sets of substrates 21, 22 from a projection image of the laminated substrate 2 in a tangential direction, at multiple points in a circumferential direction. Then, calculation means 6 detects shape data of either one of the substrate sets from a detection result of the contour measurement means 3 to determine a diameter and a center position, while as for the other substrate set, shape data is obtained from a relative positional relationship between the two sets of substrates detected by the edge shape measurement means 4, using the shape data of the other set of substrate as a standard, to determine a diameter and a center position. Thereafter, the shift amount is determined from a distance of the center position between the two sets of substrates. |
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AbstractList | PROBLEM TO BE SOLVED: To collectively determine a shift amount of a substrate center position, for a laminated substrate composed of two sets of vertically layered discoidal substrates, in element forming or the like.SOLUTION: Contour measurement means 3A detects a contour shape of two sets of superposed substrates 21, 22 from a projection image of a laminated substrate 2 in a thickness direction, while edge shape measurement means 4 detects respective edge shapes of the two sets of substrates 21, 22 from a projection image of the laminated substrate 2 in a tangential direction, at multiple points in a circumferential direction. Then, calculation means 6 detects shape data of either one of the substrate sets from a detection result of the contour measurement means 3 to determine a diameter and a center position, while as for the other substrate set, shape data is obtained from a relative positional relationship between the two sets of substrates detected by the edge shape measurement means 4, using the shape data of the other set of substrate as a standard, to determine a diameter and a center position. Thereafter, the shift amount is determined from a distance of the center position between the two sets of substrates. |
Author | AKAMATSU MASARU IBA KUNIO |
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Snippet | PROBLEM TO BE SOLVED: To collectively determine a shift amount of a substrate center position, for a laminated substrate composed of two sets of vertically... |
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SubjectTerms | BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY IMAGE DATA PROCESSING OR GENERATION, IN GENERAL MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING |
Title | POSITIONAL SHIFT DETECTOR FOR LAMINATED SUBSTRATE AND SEMICONDUCTOR MANUFACTURING DEVICE USING THE SAME, AND POSITIONAL SHIFT DETECTION METHOD FOR LAMINATED SUBSTRATE |
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