POSITIONAL SHIFT DETECTOR FOR LAMINATED SUBSTRATE AND SEMICONDUCTOR MANUFACTURING DEVICE USING THE SAME, AND POSITIONAL SHIFT DETECTION METHOD FOR LAMINATED SUBSTRATE

• Main Authors: AKAMATSU MASARU, IBA KUNIO
• Format: Patent
• Language: English
• Published: 12.01.2012
• Subjects: BASIC ELECTRIC ELEMENTS; CALCULATING; COMPUTING; COUNTING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; MEASURING; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS; PHYSICS; SEMICONDUCTOR DEVICES; TESTING

PROBLEM TO BE SOLVED: To collectively determine a shift amount of a substrate center position, for a laminated substrate composed of two sets of vertically layered discoidal substrates, in element forming or the like.SOLUTION: Contour measurement means 3A detects a contour shape of two sets of superposed substrates 21, 22 from a projection image of a laminated substrate 2 in a thickness direction, while edge shape measurement means 4 detects respective edge shapes of the two sets of substrates 21, 22 from a projection image of the laminated substrate 2 in a tangential direction, at multiple points in a circumferential direction. Then, calculation means 6 detects shape data of either one of the substrate sets from a detection result of the contour measurement means 3 to determine a diameter and a center position, while as for the other substrate set, shape data is obtained from a relative positional relationship between the two sets of substrates detected by the edge shape measurement means 4, using the shape data of the other set of substrate as a standard, to determine a diameter and a center position. Thereafter, the shift amount is determined from a distance of the center position between the two sets of substrates.